印制電路翻譯詞匯
導線：conductor trace line
齊平導線：flush conductor
傳輸線：transmission line
跨交：crossover
板邊插頭：edge-board contact
增強板：stiffener
基底：substrate
基板面：real estate
導線面：conductor side
元件面：component side
焊接面：solder side
印制：print
網格：grid
圖形：pattern
導電圖形：conductive pattern
非導電圖形：non-conductive pattern
字符：legend
標志：mark
基材：base material
層壓板：laminate
撓性印制電路：flexible printed circuit (FPC)
撓性印制線路：flexible printed wiring
剛性印制板：flex-rigid printed board, rigid-flex printed board
剛性雙面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed
剛性多層印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board
齊平印制板：flush printed board
金屬芯印制板：metal core printed board
金屬基印制板：metal base printed board
多重布線印制板：multi-wiring printed board
陶瓷印制板：ceramic substrate printed board
導電膠印制板：electro conductive paste printed board
模塑電路板：molded circuit board
模壓印制板：stamped printed wiring board
順序層壓多層印制板：sequentially-laminated multilayer
散線印制板：discrete wiring board
微線印制板：micro wire board
積層印制板：build-up printed board
積層多層印制板：build-up multilayer printed board (BUM)
積層撓印制板：build-up flexible printed board
表面層合電路板：surface laminar circuit (SLC)
埋入凸塊連印制板：B2it printed board
多層膜基板：multi-layered film substrate(MFS)
層間全內導通多層印制板：ALIVH multilayer printed board
載芯片板：chip on board (COB)
印制電路：printed circuit
印制線路：printed wiring
印制板：printed board
印制板電路：printed circuit board (PCB)
印制線路板：printed wiring board(PWB)
印制元件：printed component
印制接點：printed contact
印制板裝配：printed board assembly
板：board
單面印制板：single-sided printed board(SSB)
雙面印制板：double-sided printed board(DSB)
多層印制板：multilayer printed board(MLB)
多層印制電路板：multilayer printed circuit board
多層印制線路板：multilayer printed wiring board
剛性印制板：rigid printed board
剛性單面印制板：rigid single-sided printed board
剛性雙面印制板：rigid double-sided printed board
剛性多層印制板：rigid multilayer printed board
撓性多層印制板：flexible multilayer printed board
撓性印制板：flexible printed board
撓性單面印制板：flexible single-sided printed board
撓性雙面印制板：flexible double-sided printed board
埋電阻板：buried resistance board
母板：mother board
子板：daughter board
背板：backplane
裸板：bare board
鍵盤板夾心板：copper-invar-copper board
動態撓性板：dynamic flex board
靜態撓性板：static flex board
可斷拼板：break-away panel
電纜：cable
撓性扁平電纜：flexible flat cable (FFC)
薄膜開關：membrane switch
混合電路：hybrid circuit
厚膜：thick film
厚膜電路：thick film circuit
薄膜：thin film
薄膜混合電路：thin film hybrid circuit
互連：interconnection
覆金屬箔基材：metal-clad bade material
覆銅箔層壓板：copper-clad laminate (CCL)
單面覆銅箔層壓板：single-sided copper-clad laminate
雙面覆銅箔層壓板：double-sided copper-clad laminate
復合層壓板：composite laminate
薄層壓板：thin laminate
金屬芯覆銅箔層壓板：metal core copper-clad laminate
金屬基覆銅層壓板：metal base copper-clad laminate
撓性覆銅箔絕緣薄膜：flexible copper-clad dielectric film
基體材料：basis material
預浸材料：prepreg
粘結片：bonding sheet
預浸粘結片：pre-impregnated bonding sheer
環氧玻璃基板：epoxy glass substrate
加成法用層壓板：laminate for additive process
預制內層覆箔板：mass lamination panel
內層芯板：core material
催化板材：catalyzed board ,coated catalyzed laminate
涂膠催化層壓板：adhesive-coated catalyzed laminate
涂膠無催層壓板：adhesive-coated uncatalyzed laminate
粘結層：bonding layer
粘結膜：film adhesive
涂膠粘劑絕緣薄膜：adhesive coated dielectric film
無支撐膠粘劑膜：unsupported adhesive film
覆蓋層：cover layer (cover lay)
增強板材：stiffener material
銅箔面：copper-clad surface
去銅箔面：foil removal surface
層壓板面：unclad laminate surface
基膜面：base film surface
膠粘劑面：adhesive face
原始光潔面：plate finish
粗面：matt finish
縱向：length wise direction
模向：cross wise direction
剪切板：cut to size panel
酚醛紙質覆銅箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)
環氧紙質覆銅箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)
環氧玻璃布基覆銅箔板：epoxide woven glass fabric copper-clad laminates
環氧玻璃布紙復合覆銅箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates
環氧玻璃布玻璃纖維復合覆銅箔板：epoxide non woven/woven glass reinforced copper-clad laminates
聚酯玻璃布覆銅箔板：polyester woven glass fabric copper-clad laminates
聚酰亞胺玻璃布覆銅箔板：polyimide woven glass fabric copper-clad laminates
雙馬來酰亞胺三嗪環氧玻璃布覆銅箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad laminates
環氧合成纖維布覆銅箔板：epoxide synthetic fiber fabric copper-clad laminates
聚四乙烯玻璃纖維覆銅箔板：teflon/fiber glass copper-clad laminates
超薄型層壓板：ultra thin laminate
陶瓷基覆銅箔板：ceramics base copper-clad laminates
紫外線阻擋型覆銅箔板：UV blocking copper-clad laminates
基材的材料
A階樹脂：A-stage resin
B階樹脂：B-stage resin
C階樹脂：C-stage resin
環氧樹脂：epoxy resin
酚醛樹脂：phenolic resin
聚酯樹脂：polyester resin
聚酰亞胺樹脂：polyimide resin
雙馬來酰亞胺三嗪樹脂：bismaleimide-triazine resin
丙烯酸樹脂：acrylic resin
三聚氰胺甲醛樹脂：melamine formaldehyde resin
多官能環氧樹脂：polyfunctional epoxy resin
溴化環氧樹脂：brominated epoxy resin
環氧酚醛：epoxy novolac
氟樹脂：fluorin resin
硅樹脂：silicone resin
硅烷：silane
聚合物：polymer
無定形聚合物：amorphous polymer
結晶現象：crystalline polymer
雙晶現象：dimorphism
共聚物：copolymer
合成樹脂：synthetic
熱固性樹脂：thermosetting resin
熱塑性樹脂：thermoplastic resin
感光性樹脂：photosensitive resin
環氧當量：weight per epoxy equivalent (WPE)
環氧值：epoxy value
雙氰胺：dicyandiamide
粘結劑：binder
膠粘劑：adhesive
固化劑：curing agent
阻燃劑：flame retardant
遮光劑：opaque
增塑劑：plasticizers
不飽和聚酯：unsatuiated polyester
聚酯薄膜：polyester
聚酰亞胺薄膜：polyimide film (PI)
聚四氟乙烯：polytetrafluoetylene (PTFE)
聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (FEP)
增強材料：reinforcing material
玻璃纖維：glass fiber
E玻璃纖維：E-glass fibre
D玻璃纖維：D-glass fibre
S玻璃纖維：S-glass fibre
玻璃布：glass fabric
非織布：non-woven fabric
玻璃纖維墊：glass mats
紗線：yarn
單絲：filament
絞股：strand
緯紗：weft yarn
經紗：warp yarn
但尼爾：denier
經向：warp-wise
緯向：weft-wise, filling-wise
織物經緯密度：thread count
織物組織：weave structure
平紋組織：plain structure
壞布：grey fabric
稀松織物：woven scrim
弓緯：bow of weave
斷經：end missing
缺緯：mis-picks
緯斜：bias
折痕：crease
云織：waviness
魚眼：fish eye
毛圈長：feather length
厚薄段：mark
裂縫：split
捻度：twist of yarn
浸潤劑含量：size content
浸潤劑殘留量：size residue
處理劑含量：finish level
浸潤劑：size
偶聯劑：coupling agent
處理織物：finished fabric
聚酰胺纖維：polyamide fiber
聚酯纖維非織布：non-woven polyester fabric
浸漬絕緣縱紙：impregnating insulation paper
聚芳酰胺纖維紙：aromatic polyamide paper
斷裂長：breaking length
吸水高度：height of capillary rise
濕強度保留率：wet strength retention
白度：whiteness
陶瓷：ceramics
導電箔：conductive foil
銅箔：copper foil
電解銅箔：electrodeposited copper foil (ED copper foil)
壓延銅箔：rolled copper foil
退火銅箔：annealed copper foil
壓延退火銅箔：rolled annealed copper foil (RA copper foil)
薄銅箔：thin copper foil
涂膠銅箔：adhesive coated foil
涂膠脂銅箔：resin coated copper foil (RCC)
復合金屬箔：composite metallic material
載體箔：carrier foil
殷瓦：invar
箔（剖面）輪廓：foil profile
光面：shiny side
粗糙面：matte side
處理面：treated side
防銹處理：stain proofing
雙面處理銅箔：double treated foil
設計
原理圖：schematic diagram
邏輯圖：logic diagram
印制線路布設：printed wire layout
布設總圖：master drawing
可制造性設計：design-for-manufacturability
計算機輔助設計：computer-aided design.(CAD)
計算機輔助制造：computer-aided manufacturing.(CAM)
計算機集成制造：computer integrate manufacturing.(CIM)
計算機輔助工程：computer-aided engineering.(CAE)
計算機輔助測試：computer-aided test.(CAT)
電子設計自動化：electric design automation .(EDA)
工程設計自動化：engineering design automaton .(EDA2)
組裝設計自動化：assembly aided architectural design. (AAAD)
計算機輔助制圖：computer aided drawing
計算機控制顯示：computer controlled display .(CCD)
布局：placement
布線：routing
布圖設計：layout
重布：rerouting
模擬：simulation
邏輯模擬：logic simulation
電路模擬：circuit simulation
時序模擬：timing simulation
模塊化：modularization
布線完成率：layout efficiency
機器描述格式：machine description format .(MDF)
機器描述格式數據庫：MDF database
設計數據庫：design database
設計原點：design origin
優化（設計）：optimization (design)
供設計優化坐標軸：predominant axis
表格原點：table origin
鏡像：mirroring
驅動文件：drive file
中間文件：intermediate file
制造文件：manufacturing documentation
隊列支撐數據庫：queue support database
元件安置：component positioning
圖形顯示：graphics display
比例因子：scaling factor
掃描填充：scan filling
矩形填充：rectangle filling
填充域：region filling
實體設計：physical design
邏輯設計：logic design
邏輯電路：logic circuit
層次設計：hierarchical design
自頂向下設計：top-down design
自底向上設計：bottom-up design
線網：net
數字化：digitizing
設計規則檢查：design rule checking
走（布）線器：router (CAD)
網絡表：net list
計算機輔助電路分析：computer-aided circuit analysis
子線網：subnet
目標函數：objective function
設計后處理：post design processing (PDP)
交互式制圖設計：interactive drawing design
費用矩陣：cost matrix
工程圖：engineering drawing
方塊框圖：block diagram
迷宮：maze
元件密度：component density
巡回售貨員問題：traveling salesman problem
自由度：degrees freedom
入度：out going degree
出度：incoming degree
曼哈頓距離：Manhattan distance
歐幾里德距離：Euclidean distance
網絡：network
陣列：array
段：segment
邏輯：logic
邏輯設計自動化：logic design automation
分線：separated time
分層：separated layer
定順序：definite sequence
形狀與尺寸：
導線（通道）：conduction (track)
導線（體）寬度：conductor width
導線距離：conductor spacing
導線層：conductor layer
導線寬度/間距：conductor line/space
第一導線層：conductor layer No.1
圓形盤：round pad
方形盤：square pad
菱形盤：diamond pad
長方形焊盤：oblong pad
子彈形盤：bullet pad
淚滴盤：teardrop pad
雪人盤：snowman pad
V形盤：V-shaped pad
環形盤：annular pad
非圓形盤：non-circular pad
隔離盤：isolation pad
非功能連接盤：nonfunctional pad
偏置連接盤：offset land
腹（背）裸盤：back-bard land
盤址：anchoring spaur
連接盤圖形：land pattern
連接盤網格陣列：land grid array
孔環：annular ring
元件孔：component hole
安裝孔：mounting hole
支撐孔：supported hole
非支撐孔：unsupported hole
導通孔：via
鍍通孔：plated through hole (PTH)
余隙孔：access hole
盲孔：blind via (hole)
埋孔：buried via hole
埋/盲孔：buried /blind via
任意層內部導通孔：any layer inner via hole (ALIVH)
全部鉆孔：all drilled hole
定位孔：toaling hole
無連接盤孔：landless hole
中間孔：interstitial hole
無連接盤導通孔：landless via hole
引導孔：pilot hole
端接全隙孔：terminal clearomee hole
準表面間鍍覆孔：quasi-interfacing plated-through hole
準尺寸孔：dimensioned hole
在連接盤中導通孔：via-in-pad
孔位：hole location
孔密度：hole density
孔圖：hole pattern
鉆孔圖：drill drawing
裝配圖：assembly drawing
印制板組裝圖：printed board assembly drawing
參考基準：datum reference
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